Analog interface circuits for advanced 3D-stacked imagers

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Promoter: Georges Gielen


Description: Silicon-based image sensors are finding their way into more and more
application domains, as the level of integration and miniaturization is drastically increasing: automotive, biomedical, security and surveillance, industrial etc. These emerging applications pose a number of requirements on the silicon-based image sensor that can be summarized by means of the following trends: increasing number
of pixels at higher fill factor, smarter image sensors, combined sensitivity to both the visual spectrum as well as to (near) infrared (NIR) or ultraviolet (UV). Within the context of a project to develop a generic platform for future silicon-based image sensor applications, this PhD thesis will investigate and design innovative analog interface circuits that enable 3D-stacked imagers. Emphasis is on both architectural work and detailed circuit design and implementation.

Key words: analog integrated circuits - sensor interfaces - smart imagers

Latest application date: 2010-11-30

Financing: available

Type of Position: scholarship

Duration of the Project : 4 years

Link:

Research group: Department of Electrical Engineering (ESAT)

Remarks: project and PhD start on Jan 1, 2010